ICCPMT 2013 will be the most comprehensive conference focused on the various aspects of advances in Components, Packaging and Manufacturing Technology. Our conference provides a chance for academic and industry professionals to discuss recent progress in the area of Components, Packaging and Manufacturing Technology.

The goal of this conference is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Components, Packaging and Manufacturing Technology. The complete list of topics are updating. Please check the Call for Papers section.

All accepted papers from ICCPMT 2013 will also be published on international journal Applied Mechanics and Materials (ISSN: 1660-9336),and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP) , and other indexing services ( See TTP's Conference List ). The full text is online available via platform www.scientific.net .